Automotive electronics
· Silicone for bonding body control electronic modules
· Silicone for ECU heat conduction, potting and coating
· Hybrid inverter heat conduction adhesive
Car air conditioning
PTC heater bonding in car air conditioning, it is recommended that Baikal Meidao single component addition curing bonding adhesive, providing long-term thermal stability bonding, rapid heating curing, no curing byproducts.
| Model | Application product | Product type | component type | curing conditions | Advantages |
| MDSI 7445 | PTC heater | Silicone | One-component | heating curing | Thermal bonding |
| MDSI 7321 | resistor | Silicone | One-component | room temperature curing | Cavity filling |
| MDPU 8608 | resistor | polyurethane | Two-component | room temperature curing or heating curing | Potting |
On-board display
Full fit of touch screen, recommended two-component silicone gel, optically transparent material, can be fitted with a variety of LCD display module window material, its optical characteristics are excellent.
| Model | Application product | Product type | component type | curing conditions | Advantages |
| MDGEL 6602 | The touch screen fully fitted | Silicone | Two-component | room temperature curing or heating curing | Fully bonded silicon gel |
| MDSI 7005 | The touch screen fully fitted | Silicone | One-component | room temperature curing | Border seal |
Electronic module
Automotive electronic module includes regulator, ignition module, circuit board three prevention, ECU control module, charging pile and DC contactor, etc.
| Model | Application product | Product type | component type | curing conditions | Advantages |
| MDGEL 6708 | regulator | Silicone | Two-component | room temperature curing or heating curing | pcb Chip protection |
| MDSI 7435 | regulator | Silicone | One-component | heating curing | The heat dissipation plate is glued to the shell |
| MDSI 7435 | regulator | Silicone | One-component | heating curing | The heat dissipation plate is glued |
| MDEP 321 | regulator | epoxy | One-component | heating curing | The heat dissipation plate is glued |
| MDGEL 6605 | ignition module | Silicone | Two-component | room temperature curing or heating curing | pcb protect |
| MDSI 6125 | ignition module | Silicone | Two-component | room temperature curing or heating curing | pcb Fill protection |
| MDCOAT 7060 | PCB coating | Silicone | One-component | room temperature curing | pcb coating |
| MDCOAT 7060 | ECU Control MODule | Silicone | One-component | room temperature curing | pcb coating |
| MDGEL 6606 | ECU Control MODule | Silicone | Two-component | room temperature curing or heating curing | pcb protect |
| MDPU 8608 | ECU Control MODule | polyurethane | Two-component | room temperature curing or heating curing | pcb protect |
| MDSI N7339 | ECU Control MODule | Silicone | Two-component | room temperature curing | Shell seal |
| MDSI 7005 | ECU Control MODule | Silicone | One-component | room temperature curing | Shell seal |
| MDSI 7060 | charging pile | Silicone | One-component | room temperature curing | pcb coating |
| MDPU 8608 | charging pile | polyurethane | Two-component | room temperature curing or heating curing | Inductive potting |
| MDTC 35# | charging pile | Silicone | One-component | / | Inductive heat dissipation protection |
| MDEP 3115 | DC contactor | epoxy | Two-component | room temperature curing or heating curing | Potting protection |
Automotive Sensors
Automotive electronic sensors are mainly used in braking systems, transmission systems, engine systems, speed position systems, vehicle air conditioning systems and other fields.
The main sensor types are gear, air pressure, oil pressure, steering Angle, speed, position, tire pressure, temperature, humidity, air quality, rainfall, light amount, oxygen sensing and so on.
Beginor Technology helps drive in the direction of safety, comfort, energy saving and intelligence.
| Model | Application product | Product type | component type | curing conditions | Advantages |
| MDGEL 6708 | Vacuum booster pressure sensor | Silicone | Two-component | room temperature curing or heating curing | Gel potting |
| MDSI 7435 | Vacuum booster pressure sensor | Silicone | One-component | heating curing | Shell seal |
| MDSI 7336 | Vacuum booster pressure sensor | Silicone | One-component | room temperature curing | Shell seal |
| MDSI 7336 | DPS Differential Sensor | Silicone | One-component | room temperature curing | ceramic substrate |
| MDSI N7339 | DPS Differential Sensor | Silicone | One-component | room temperature curing | PA66 Adhesive seal |
| MDEP 3102 | Hall sensor | epoxy | Two-component | room temperature curing or heating curing | Shell internal potting |
| MDEP 3112 | Hall sensor | epoxy | Two-component | room temperature curing or heating curing | Shell internal potting |
| MDEP 3102 | tire pressure sensor | epoxy | Two-component | room temperature curing or heating curing | Shell internal potting |
| MDEP 3112 | tire pressure sensor | epoxy | Two-component | room temperature curing or heating curing | Shell internal potting |
| MDEP 3124 | Strain gauge pressure sensor | epoxy | Two-component | room temperature curing or heating curing | Potting |
| MDEP 3124 | temperature sensor | epoxy | Two-component | room temperature curing or heating curing | Potting |
| MDEP 321 | temperature sensor | epoxy | One-component | heating curing | Induction head package |
| MDEP 3124 | speed transmitter | epoxy | Two-component | room temperature curing or heating curing | Potting |
| MDEP 3124 | Transmission pressure sensor | epoxy | Two-component | room temperature curing or heating curing | Potting |
| MDEP 3112 | inductive transducer | epoxy | Two-component | room temperature curing or heating curing | Inductor coil potting |
Lithium Battery
Beginor Technology single component silicone to meet the lithium battery border sealing can be repaired process, with good waterproof performance and sealing capacity.
BMS battery management system positioning protection and excellent thermal conductivity and electrical insulation performance.
| Model | Application product | Product type | component type | curing conditions | Advantages |
| MDCOAT 7060 | BMS Control MODule | Silicone | One-component | room temperature curing or heating curing | pcb coating |
| MDSI 7333 | BMS Control MODule | Silicone | One-component | room temperature curing | pcb coating |
| MDGP 6815 | BMS Control MODule | Silicone | Two-component | room temperature curing or heating curing | pcb coating |
| MDSI N7339 | Battery case | Silicone | One-component | room temperature curing | Box seal |
| MDSI 7338 | Battery case | Silicone | One-component | room temperature curing | Box seal |
| MDEP 3005 | Battery case | epoxy | Two-component | room temperature curing | Box seal |
| MDPU 8608 | Soft pack cell potting | polyurethane | Two-component | room temperature curing or heating curing | Soft pack cell potting |
| MDSI 6230 | Soft pack cell potting | Silicone | Two-component | room temperature curing or heating curing | Soft pack cell potting |
| MDEP 3005 | Cell bonding | epoxy | Two-component | room temperature curing | Cell bonding |
| MDSI 7317 | Cell bonding | Silicone | One-component | room temperature curing | Cell bonding |
| MDEP 3005 | Solder joint protection | epoxy | Two-component | room temperature curing | Potting |
| MDEP 3225FR | Solder joint protection | epoxy | Two-component | room temperature curing or heating curing | Potting |
| MDGP 6815 | BMS Control MODule | Silicone | Two-component | room temperature curing or heating curing | thermal pad |
