Inverter Scheme
The photovoltaic inverter is the heart of the solar photovoltaic power generation system, which converts the generated direct current into alternating current through conversion technology.。
For the environment of photovoltaic power station, a safe and stable working environment is extremely important.
The thermal conductivity and three defenses of its power components can be realized mainly through adhesive potting.
series inverters
Model | Application product | Product type | component type | curing conditions | Advantages |
MDSI 6230(15#) | Inductance heat conduction potting | Silicone | Two-component | room temperature curing or heating curing | thermal conductivity 1.5W/m.K |
MDSI 7333 | wire harness reinforcement fixing | Silicone | Owo-component | room temperature curing | Table dry time 3 minutes |
MDSI 7336 | bonding shell | Silicone | Owo-component | room temperature curing | flame retardant |
MDSI 7317 | bonding shell | Silicone | Owo-component | room temperature curing | thermal conductivity 1.6W/m.K |
MDEP 3211 | bonding fixed inductor coil | epoxy | Two-component | room temperature curing or heating curing | strong adhesion to various substrates |
MDCOAT 7062 | circuit board three protection | Silicone | Owo-component | room temperature curing | low viscosity, environmental protection |
MDTC | heat dissipation of heating components | Silicone | Two-component | room temperature curing or heating curing | thermal conductivity 2.0-3.5 W/m.K |
micro inverters
Model | Application product | Product type | component type | curing conditions | Advantages |
MDSI 6230(1#) | heat conduction potting | Silicone | Two-component | room temperature curing or heating curing | self-adhesive heat conduction can be repaired |
MDSI 7096 | sealing materials | Silicone | Owo-component | room temperature curing | Table dry time 3 minutes |
MDSI 7091 | solder joint protection | Silicone | Owo-component | room temperature curing | flame retardant |
MDTC | heat dissipation of heating components | Silicone | Two-component | room temperature curing or heating curing | thermal conductivity 2.0-3.5 W/m.K |