Consumer electronics
The field of touch screen is developing rapidly, taking mobile phone touch screen as an example, the current mobile phone touch screen is still used in the traditional acrylic glue, the use of optical organic silicone is not common.
Adhesives/electromagnetic shielding electronic materials leader, Beginor Technology in the 5G era of communication equipment, smart phones and new energy vehicles and other fields have layout.
It includes semi-sintered chip bonding adhesive for 5G chip heat dissipation, high thermal conductivity gaskets for communication equipment, chat-level electromagnetic interference (EMI) shielding solutions, mobile phone camera module bonding protection materials, automotive cameras and vehicle-mounted radar bottom filling materials.
In handheld devices, Beginor Technology provides comprehensive solutions, such as: LCD touch screen full bonding, camera module assembly bonding, UBS waterproof seal, speaker seal, circuit board three anti-coating, power device heat dissipation, etc.
Model | Application product | Product type | component type | curing conditions | Advantages |
MDGEL 6708 | LCD TP fully fit | Silicone | Two-component | room temperature curing or heating curing | The touch screen is bonded to the LCD screen |
MDGEL 6602 | LCD TP fully fit | Silicone | Two-component | room temperature curing or heating curing | The touch screen is bonded to the LCD screen |
MDSI 7102B-1-14 | TYPE C connector | Silicone | One-component | room temperature curing | PIN bonded and fixed |
MDEP 3225FR | Camera module | epoxy | Two-component | room temperature curing or heating curing | The lens is bonded to the base |
MDEP 3112 | loudspeaker | epoxy | Two-component | room temperature curing or heating curing | Internal device potting |
MDGR 5512 | Power device heat dissipation | Silicone | One-component | / | Heat dissipation bonding of components |
MDGR 5525 | Power device heat dissipation | Silicone | One-component | / | Heat dissipation bonding of components |
MDSI 7316 | Power device heat dissipation | Silicone | One-component | room temperature curing | Heat dissipation bonding of components |
MDCOAT 7060 | pcb coating | Silicone | One-component | room temperature curing or heating curing | pcb coating |
MDCOAT 721L | pcb coating | Silicone | One-component | room temperature curing or heating curing | pcb coating |