The battery PACK
The battery PACK consists of battery pack, bus bar, soft connection, protection plate, outer packing, output (including connector), highland barley paper, plastic support and other auxiliary materials. PACK assembly technology material strength is particularly critical for battery companies.
| Model | Application product | Product type | component type | curing conditions | Advantages |
| MDSI 6230(7#) | Lithium electric sealing | Silicone | Two-component | room temperature curing or heating curing | Low density, light weight non-foaming |
| MDSI 6230(15#) | Lithium electric sealing | Silicone | Two-component | room temperature curing or heating curing | thermal conductivity1.5W/m.K |
| MDFOAM 6230 | Lithium electric sealing | Silicone | Two-component | room temperature curing or heating curing | Low density foamed silicon |
| MDPU 8608 | Lithium electric sealing | polyurethane | Two-component | room temperature curing or heating curing | Excellent flexibility after curing |
| MDPU 8110 | cell structure bonding | polyurethane | Two-component | room temperature curing or heating curing | Strong adhesion to various substrate |
| MDPU 8650 | cell structure bonding | polyurethane | Two-component | room temperature curing or heating curing | thermal conductivity bonding1.2W/m.K |
| MDGP 6825 | Battery bottom and bin body heat conduction | Silicone | Two-component | room temperature curing or heating curing | thermal conductivity 2.5 W/mK |
| MDTC 35# | Battery bottom and bin body heat conduction | Silicone | One-component | room temperature curing | thermal conductivity 3.5W/mk |
| BEPU 6103 | Battery bottom and bin body heat conduction | polyurethane | Two-component | room temperature curing or heating curing | room temperature 30mins rapid curing |
| MDPU 8650 | Battery bottom and bin body heat conduction | polyurethane | Two-component | room temperature curing or heating curing | thermal conductivity bonding1.2W/m.K |
| MDCOAT 7007 | BMS(PCB three defenses) | Silicone | One-component | room temperature curing | One-component 80 shore A |
| MDSI 7001 | BMS(PCB three defenses) | Silicone | One-component | room temperature curing | low viscosity, good flow |
| MDSI 7333 | BMS(PCB three defenses) | Silicone | One-component | room temperature curing | resistance to moisture, dirt |
| MDSI 7002 | BMS(PCB three defenses) | Silicone | One-component | room temperature curing | no yellowing, no oil seepage |
