Semiconductors
Adhesive in the semiconductor application variety, according to the use of the function to distinguish, the main categories include power module chip sealing protection, heat plate and shell bonding, ceramic substrate and heat plate bonding; And the sealing and bonding of power components.
We has been committed to the research, development and application of electronic adhesives for many years. The adhesive product line generated by multi-technical fundamentals serves the majority of users and meets the different and special needs of different categories of applications.
power module
There are many types of electronic modules, common types power module, power module, current or voltage regulator module, IGBT module, field effect module, rectifier module, IPM module,PIM module,silicon controlled module, frequency conversion module.
| Model | Application product | Product type | component type | curing conditions | Advantages |
| MDGEL 6606 | IGBT | Silicone | Two-component | room temperature curing or heating curing | Chip potting protection |
| MDSI 7435 | IGBT | Silicone | One-component | heating curing | The heat dissipation plate is glued to the shell |
| MDSI 7500 | IGBT | Silicone | One-component | heating curing | Bonding of ceramic and heat dissipation plate |
| MDGEL 6606 | thyristor | Silicone | Two-component | room temperature curing or heating curing | Chip potting protection |
| MDSI 7435 | thyristor | Silicone | One-component | heating curing | The heat dissipation plate is glued to the shell |
| MDSI 7500 | thyristor | Silicone | One-component | heating curing | Bonding of ceramic and heat dissipation plate |
| MDEP 3225FR | thyristor | epoxy | Two-component | room temperature curing or heating curing | The terminal is potting and fixed |
| MDGEL 6606 | silicon controlled | Silicone | Two-component | room temperature curing or heating curing | Chip potting protection |
| MDSI 7435 | silicon controlled | Silicone | One-component | heating curing | The heat dissipation plate is glued to the shell |
| MDSI 7500 | silicon controlled | Silicone | One-component | heating curing | Bonding of ceramic and heat dissipation plate |
| MDEP 3225FR | silicon controlled | epoxy | Two-component | room temperature curing or heating curing | The terminal is potting and fixed |
| MDEP 3115 | rectifier bridge | epoxy | Two-component | room temperature curing or heating curing | Terminal potting |
High Power Devices
Our thermosetting one-component epoxy adhesives meet the requirements of sealing triode package holes. Maidao's organic silicone plays a key role in the bonding of tantalum capacitor growth barrier lines and chips.
| Model | Application product | Product type | component type | curing conditions | Advantages |
| MDEP 3688 | audion | epoxy | One-component | heating curing | Sealing of package holes |
| MDEP 3688-15 | audion | epoxy | One-component | heating curing | Sealing of package holes |
| MDPM 1263 | tantalum capacitor | base coating | One-component | / | Silicone base coating |
| MDSI 7001 | tantalum capacitor | Silicone | One-component | heating curing | Glue for growing barrier lines |
| MDSI 7435 | tantalum capacitor | Silicone | One-component | heating curing | Chip bonding |
