Sensors
There are many categories of sensors, common distance sensors, Hall sensors, temperature sensors, temperature and humidity sensors, load sensors, pressure sensors, load sensors, displacement sensors, photoelectric sensors and so on.
M.D.Tech adhesive has been applied in a variety of sensors, different characteristics of sealant and potting materials to meet the structural requirements and functional requirements of different needs of sensor design.
electromagnetic sensor
The potting adhesives developed by us are used on electromagnetic sensors to meet the good softness and adhesion. According to the size of the sensor, the adhesive products with excellent adhesion, bright surface and moderate toughness are the characteristics of many of our molding products.
Model | Application product | Product type | component type | curing conditions | Advantages |
MDEP 3102 | Induction gate | epoxy | Two-component | room temperature curing or heating curing | Potting |
MDSI 6230 | Induction gate | Silicone | Two-component | room temperature curing or heating curing | Potting |
MDPU 8608 | Induction gate | polyurethane | Two-component | room temperature curing or heating curing | Potting |
MDPU 8608 | Hall sensor | polyurethane | Two-component | room temperature curing or heating curing | Potting |
MDSI 6125 | Hall sensor | Silicone | Two-component | room temperature curing or heating curing | Potting |
MDSI 6230 | Hall sensor | Silicone | Two-component | room temperature curing or heating curing | Potting |
MDPU 8650 | Hall sensor | polyurethane | Two-component | room temperature curing or heating curing | Potting |
MDSI 6125 | Hall sensor | Silicone | Two-component | room temperature curing or heating curing | Potting |
MDSI 6230 | Hall sensor | Silicone | Two-component | room temperature curing or heating curing | Potting |
MDEP 3115 | Hall sensor | epoxy | Two-component | room temperature curing or heating curing | Potting |
MDEP 3225FR | temperature sensor | epoxy | Two-component | room temperature curing or heating curing | Potting |
MDGR 5512 | temperature sensor | Silicone | One-component | / | Potting |
pressure sensor
Our potting adhesive in the pressure sensor to meet the excellent adhesion, good waterproof, moisture resistance, excellent electrical insulation, stability.
Model | Application product | Product type | component type | curing conditions | Advantages |
MDEP 3688-30 | pressure sensor | epoxy | One-component | heating curing | Shell bonding adhesive |
MDSI 6708 | pressure sensor | Silicone | Two-component | room temperature curing or heating curing | Potting gel |
MDSI 7420 | pressure sensor | Silicone | One-component | heating curing | sealant |
MDEP 3211 | pressure sensor | epoxy | Two-component | room temperature curing or heating curing | cover plate adhesive |
MDCOAT 7060 | pressure sensor | Silicone | One-component | room temperature curing or heating curing | conformal coating |
MDSI 6230 | Throttle sensor | Silicone | Two-component | room temperature curing or heating curing | Potting |
MDSI 7102 | tire pressure sensor | Silicone | One-component | room temperature curing | sealant |
MDSI 6230 | tire pressure sensor | Silicone | Two-component | room temperature curing or heating curing | Potting |
MDSI 6707 | tire pressure sensor | Silicone | Two-component | room temperature curing or heating curing | Potting |
MDGEL 6605 | weighing sensor | Silicone | Two-component | room temperature curing or heating curing | Potting |
MDSI 7102 | weighing sensor | Silicone | One-component | room temperature curing | cover plate sealant |
MDCOAT 7060 | weighing sensor | Silicone | One-component | room temperature curing or heating curing | PCB protection |
MDSI 7001 | weighing sensor | Silicone | One-component | room temperature curing | Chip protection gel |
MDEP 3220 | pressure switch | epoxy | Two-component | room temperature curing or heating curing | Potting |
MDEP 3688-15 | pressure switch | epoxy | One-component | heating curing | Potting |
range sensor
Range sensors include astern radar, displacement sensors. Liquid level sensor, photoelectric sensor. Based on the sensor performance requirements, BaiKO MaiDA offers solutions to meet different needs.
Model | Application product | Product type | component type | curing conditions | Advantages |
MDSI 6230 | car backing radar | Silicone | One-component | heating curing | Potting |
MDSI 7333 | car backing radar | Silicone | Two-component | room temperature curing or heating curing | seal |
MDSI 6201 | car backing radar | Silicone | One-component | heating curing | Foam filler |
MDEP 3102 | displacement sensor | epoxy | Two-component | room temperature curing or heating curing | Potting |
MDSI 6230 | displacement sensor | Silicone | One-component | room temperature curing or heating curing | Potting |
MDEP 3115 | liquid level sensor | Silicone | Two-component | room temperature curing or heating curing | Heat resistant potting |
MDEP 3220 | liquid level sensor | Silicone | One-component | room temperature curing | Potting |
MDPU 8030 | photoelectric sensor | Silicone | Two-component | room temperature curing or heating curing | Soft potting |
MDEP 3110 | photoelectric sensor | Silicone | Two-component | room temperature curing or heating curing | Potting |
MDEP 3018 | photoelectric sensor | Silicone | Two-component | room temperature curing or heating curing | High dielectric constant potting |